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BT-903 Encapsulating Adhesive

AB adhesive is a two-component curing epoxy resin adhesive that meets the requirements of low halogen content of less than 900 ppm total chlorine content and less than 1500 ppm total halogen content. It has the characteristics of excellent heat resistance, strong water resistance, good insulation, low stress, and good adhesion. It is universally suitable for bonding materials such as ceramics, metals and plastics.

  • Details
  • Application

Material properties before curing

Inspect the item

A

B

Paint appearance

Clear liquid

Brownish-yellow liquid

Key Ingredients:

Modified epoxy

Modified amine

Viscosity mPa.s (2rpm 25°C)

15000±5000

30000±5000

Viscosity after mixing

20000±5000


How to use:

1. The two components of AB are directly mixed and glued evenly for bonding.

2. Curing conditions: 120°C×60 minutes, 140°C×30 minutes

Due to the different sizes of the bonded objects or whether the oven has ventilation conditions will cause different curing degrees, it is necessary to confirm whether the curing conditions used can meet the design requirements before batch use.



Material curing properties (room temperature °C× 24 hours)

project

Detection method

unit

Numerical values

Color

Visual inspection


Yellow or brownish-yellow transparent solid

Hardness (25°C)

GB/T 2411-2008

Shaw D

65±5

Breakdown voltage

GB/T 1695-2005

kV/mm

>18

Glass temperature

DSC

100±10

Linear expansion coefficient (below Tg)

TMA

/℃

55×10-6

Linear expansion coefficient (above Tg)

TMA

/℃

131×10-6

Shear strength (aluminum/aluminum)

GB/T 6329-1996

MPa

22

Volumetric resistivity (500V/25°C)

GB/T 1410-2006

W.cm

3×1015


Shear strength at different temperatures (aluminum/aluminum)

temperature

Shear strength/MPa

25℃

25

60℃

21

100℃

7

120℃

5


Storage

A. When the ambient temperature is 4~10°C, the quality assurance period: 6 months; Seal and store in a dark place.

B. Trade-offs are determined after re-testing products more than 6 months from the date of manufacture.

Disclaimer:

This technical data is typical data tested under specific conditions, not a specification acknowledgment, and is for reference only. Please refer to the measured data when using it.