The product has excellent heat resistance function after curing (short-term heat resistance can be up to 400 °C coating film does not foam, does not crack), bond strength, cold and thermal shock resistance and excellent heat resistance, strong water resistance, good insulation, low stress and other characteristics. This product is environmentally friendly.
2. Material pre-curing properties
| Inspect the item |
|
Paint appearance | Black paste |
Key Ingredients: | Multifunctional epoxy resins, heat-resistant heterocyclic curing agents, polyimide resins, thermal conductive materials |
Concentration mPa.s (2rpm 25°C) | 5000±1000 |
Solids content | 28% |
3. How to use
1) Brush or drop glue.
2) Curing conditions:
After the workpiece is glued, it is placed at room temperature for 2 hours or blown by the wind for 15 minutes, and some of the solvent is volatilized.
3) The workpiece is directly put into 120°C for pre-baking for 10~30 minutes, and then baked at 190~200°C for 30~60 minutes.
4) The viscosity size can be diluted with ketone solvents (butanone or DMF).
*Due to the different sizes of the encapsulated or bonded objects or whether the oven has ventilation conditions will cause different curing degrees, it is necessary to confirm whether the curing conditions used can meet the design requirements before batch use.
4. Material Curing Properties (24 hours)
project | Detection method | unit | Numerical values |
Hardness (25°C) | GB/T 2411-2008 | Shaw D | 55±5 |
Breakdown voltage | GB/T 1695-2005 | kV/mm | >18 |
thermal conductivity |
| w/k | 0.35±2 |
Dielectric strength |
| KV | 20 |
Volumetric resistivity (500V/25°C) | GB/T 1410-2006 | W.cm | 3×1015 |
5. Storage
A. Refrigerated storage, pay attention to ventilation, quality assurance period: 6 months.
B. Trade-offs are determined after re-testing products more than 6 months from the date of manufacture.
Disclaimer:
This technical data is typical data tested under specific conditions, not a specification acknowledgment, and is for reference only. Please refer to the measured data when using it.